"Denver, CO, July 28, 2005- Mushkin announces a new heatsink for high performance DRAM memory modules. The new heatsink is designed to handle the increased thermal demands of today's high performance PCs. The new design delivers superior thermal conductivity and dissipation. It's sleek and aero-efficient design provides 58% more surface area than Mushkin’s previous heatsink.
"By opening up the design we improved airflow in and around the memory module and increased the surface area," says Brian Flood, head of Mushkin's product development. "It's far superior in performance and appearance."
Additionally, the new design utilizes an advanced thermal adhesive with double the thermal conductivity of the previous material. Mushkin is using the new heatsink on all its performance DDR and DDR2 products, such as the Redline series products that benefit the most from the new design, like the popular Redline and Xtreme series products. Expect to see the new heatsink on all Mushkin performance DDR products."
That was the PR released a few days to the press worldwide but of course it is no substitute to a first hand, hands on look. And here it is!
Ok, couple of things off the bat here; the first is that we have no idea if this is Mushkins new retail packaging or just what was used for this sample, however the package did include both an aluminium case badge and a 'Proof of Purchase' label inside (presumably for future promotions). The second is that this isn't an actual memory stick but a blank PCB with the new heatsink mounted on it.
The thing that makes this quite different from the usual Mushkin design is the circular holes along the top, which should aid in airflow, assuming you have some form of airflow going across the ram area. BTX design will most likely make more of an effect here. The holes appear to align with the actual ram chips themselves, so that air can reach down the sides of the chips. The new heatsink also takes up a lot more space, increasing the surface area and therefore the cooling potential.
To attach the heatsink to the ram stick is a twofold process. The first is two silver clips which are small and designed to follow the contour of the heatsink across the top. The second is a new thermal adhesive which claims to double the thermal conductivity of previous materials.
As heatsink's for ram goes, this new one from Mushkin does appeal aesthetically to me personally and we look forward to seeing this in action on Mushkins ram. Starting this week, all of Mushkins performance ram will be shipped using this new design (not just the Redline range that this sample is marked for) so expect to see a more of this in the coming weeks.
Editor's Note: We mentioned at the start that the product has not been named yet, but Mushkin are looking for ideas. If you want to toss in a thought or two, click here and score yourself a chance to win some ram as a "thank you".
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