"Denver,
CO, July 28, 2005- Mushkin announces a new heatsink for high performance
DRAM memory modules. The new heatsink is designed to handle the
increased thermal demands of today's high performance PCs. The
new design delivers superior thermal conductivity and dissipation.
It's sleek and aero-efficient design provides 58% more surface
area than Mushkin’s previous heatsink.
"By
opening up the design we improved airflow in and around the memory
module and increased the surface area," says Brian Flood,
head of Mushkin's product development. "It's far superior
in performance and appearance."
Additionally, the new design utilizes an advanced thermal adhesive
with double the thermal conductivity of the previous material.
Mushkin is using the new heatsink on all its performance DDR and
DDR2 products, such as the Redline series products that benefit
the most from the new design, like the popular Redline and Xtreme
series products. Expect to see the new heatsink on all Mushkin
performance DDR products."
That
was the PR released a few days to the press worldwide but of course
it is no substitute to a first hand, hands on look. And here it
is!
Ok,
couple of things off the bat here; the first is that we have
no idea if this is Mushkins new retail packaging or just what
was used for this sample, however the package did include both
an aluminium case badge and a 'Proof of Purchase' label inside
(presumably for future promotions). The second is that this
isn't an actual memory stick but a blank PCB with the new heatsink
mounted on it.
The
thing that makes this quite different from the usual Mushkin
design is the circular holes along the top, which should aid
in airflow, assuming you have some form of airflow going across
the ram area. BTX design will most likely make more of an effect
here. The holes appear to align with the actual ram chips themselves,
so that air can reach down the sides of the chips. The new heatsink
also takes up a lot more space, increasing the surface area
and therefore the cooling potential.
To
attach the heatsink to the ram stick is a twofold process. The
first is two silver clips which are small and designed to follow
the contour of the heatsink across the top. The second is a
new thermal adhesive which claims to double the thermal conductivity
of previous materials.
As
heatsink's for ram goes, this new one from Mushkin does appeal
aesthetically to me personally and we look forward to seeing this
in action on Mushkins ram. Starting this week, all of Mushkins
performance ram will be shipped using this new design (not just
the Redline range that this sample is marked for) so expect to
see a more of this in the coming weeks.
Editor's
Note: We mentioned at the start that the product has not been
named yet, but Mushkin are looking for ideas. If you want to toss
in a thought or two, click
here and score yourself a chance to win some ram as a "thank
you".
HOME
